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Conferences > ACPC > 2019 > M4B > M4B.6
  • Asia Communications and Photonics Conference (ACPC) 2019
  • OSA Technical Digest (Optica Publishing Group, 2019),
  • paper M4B.6

Design and Fabrication of SiN-Si Dual-layer Optical Phased Array Chip

Wang Pengfei, Luo Guangzhen, Yu Hongyan, Zhou Xuliang, Zhang Yejin, and Pan Jiaoqing

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Abstract

A 64-channel SiN-Si dual-layer optical phased array (OPA) chip is designed and fabricated. It combines the low loss of SiN with the excellent modulation performance of Si, which improves the performance of Si single-layer OPA.

© 2019 The Author(s)

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