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Conferences > ACPC > 2019 > T4D > T4D.5
  • Asia Communications and Photonics Conference (ACPC) 2019
  • OSA Technical Digest (Optica Publishing Group, 2019),
  • paper T4D.5

Compact Spectrometer Chips Based on Fs Laser Written Multi-layer Scattering Medium

Qi Sun, Tom Vettenburg, Timothy Lee, David Phillips, Martynas Beresna, and Gilberto Brambilla

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Abstract

A compact spectrometer with 0.2 nm resolution is demonstrated with a scattering chip in silica substrate. The chip is fabricated using femtosecond laser writing allowing to achieve high scattering efficiency within 100 micron thick layer.

© 2019 The Author(s)

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