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Material Processing with Picosecond 2-μm Pulses from Ho:YAG Amplifier

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Abstract

Robust 2.09-μm, 3.2-ps, 1.6-mJ, 16-W Ho:YAG CPA system with a simple dispersion and bandwidth management is developed and employed for material-processing. Successful de-bonding of aluminum through silicon wafer by 2-μm picosecond pulses is demonstrated.

© 2019 The Author(s)

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