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Laser annealing and crystallization of silicon

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Abstract

Intense laser beams are ideally suited for heat treatment of semiconductor films. The control over the extent of the heated zone, achieved by a suitable match of laser parameters to optical and thermal properties of materials, allows rapid and efficient processing of thin <1-μm layers. In particular, annealing of ion implantation damage has been achieved by laser irradiation.

© 1981 Optical Society of America

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