Abstract

The application of laser beams to semiconductor device fabrication is not a new field of endeavor. Lasers have been employed for many years to cut, drill, weld, and otherwise shape passive microelectronic components. During the past few years, however, the application of laser irradiation to the active portions of the devices has received great attention. Essentially laser beams may be used simply as sources of high intensity energy or may be used to stimulate photochemically a desired reaction at the semiconductor surface. This presentation will be concerned only with the thermal processing capabilities of laser beams.

© 1982 Optical Society of America

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