Abstract

Deep UV material processing is of widespread interest in the microelectronics industry. Researchers have demonstrated a variety of advanced UV processing applications ranging from chemical modification of materials to innovative diagnostics. Much of this advancement can be attributed to the commercial development of the excimer laser. The deep UV energy and high peak power of this device can efficiently initiate photochemical and/or photothermal surface reactions leading to material deposition or removal. This latter aspect, excimer laser etching, has been applied to several classes of material utilizing both gas and liquid phase etchants.¹

© 1988 Optical Society of America