Abstract

Advances in semiconductor manufacturing technology have led to ultralarge scale integrated circuits that have submicron pattern dimensions, but yield remains a problem. Removal of particles ~10 times smaller than the pattern size is the major limiting factor in the manufacture of such high density devices. As the particle size decreases, the particle weight becomes less significant compared with other adhesive forces, and as a result submicron particles are the most difficult to remove by conventional means. Contaminant particulates adversely affect other systems such as high power optics where particles on surfaces and interfaces can increase optical absorption and decrease laser damage threshold.

© 1990 Optical Society of America