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Optica Publishing Group
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 1992),
  • paper CTuL1

OE device and PIC/OEIC requirements for optical interconnects

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Abstract

Optical interconnect (OI) draws from optics-based telecommunication technologies and is considered a path toward the realization of optoelectronic computing through increased connectivity. Various optical devices, electronic and. photonic integrated circuits (ICs and PICs), and optoelectronic integrated circuits (OEICs) covering several functionalities, such as fixed wavelength and wavelength agile emitters, manipulators (modulators, switches, amplifiers, and multiplexers and demultiplexers), detectors, and optical memory, are relevant in optical interconnects, High-speed (28-GHz) direct modulation1,2 and the possibility for indirect modulation to up to 100+ GHz,3 together with optical detection at frequencies up to 110 GHz with an associated responsivity-bandwidth product of >22 AW−1 GHz,4 have recently been demonstrated. In parallel, progress in several areas of optoelectronic integration, such as LED/FET and LED/HBT array integration, optical waveguide modulators and lasers integrated with electronic circuits, and sophisticated optical receiver/demultiplexers have also been reported. While these devices and circuits have definite bearing on optical interconnects and optoelectronic processing, their impact may not be felt immediately, instead, hybrid integration and interconnections between optical device and arrays, and electronics will play a more practical role in the near future.1,3

© 1992 Optical Society of America

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