VACNT-on-Silicon Platform for Improving Heat Conduction in Optoelectronic Packaging

Szu-Chieh Chen; Hsinyi Lo; Yung-Jr Hung; Yen-Ting Pan; San-Liang Lee; San-Liang Lee; Rajeev J. Ram

doi:10.1364/CLEO_AT.2011.AWA5

CLEO:2011 - Laser Applications to Photonic Applications
OSA Technical Digest (CD) (Optica Publishing Group, 2011),
paper AWA5
•https://doi.org/10.1364/CLEO_AT.2011.AWA5

VACNT-on-Silicon Platform for Improving Heat Conduction in Optoelectronic Packaging

Szu-Chieh Chen, Hsinyi Lo, Yung-Jr Hung, Yen-Ting Pan, San-Liang Lee, and Rajeev J. Ram

CLEO: Applications and Technology 2011

Baltimore, Maryland United States
1–6 May 2011
ISBN: 978-1-55752-910-7

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Energy Efficient Lighting (AWA)

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S. Chen, H. Lo, Y. Hung, Y. Pan, S. Lee, and R. J. Ram, "VACNT-on-Silicon Platform for Improving Heat Conduction in Optoelectronic Packaging," in CLEO:2011 - Laser Applications to Photonic Applications, OSA Technical Digest (CD) (Optica Publishing Group, 2011), paper AWA5.

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Abstract

Silicon platforms with high-density vertically aligned carbon nanotubes on patterned substrates are designed to provide efficient thermal transfer for optoelectronic chips. 20% increase in output power is obtained when applying for LED packaging.

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