Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > CLEO_AT > 2018 > ATu4M > ATu4M.3

Roughness measurements of Al and Cu particles in Laser-Induced forward transferring process

M. H. Azhdast, H. J. Eichler¹, K.-D. Lang, V. Glaw, and M. Kossatz

Not Accessible

Your library or personal account may give you access

Abstract

Cu and Al particles were optimized to create thin films by laser direct transfer on Si-wafer substrate with minimal measured roughness; Cu-LIFT results are especially promising at high repetition rates and minimal pulse energy.

© 2018 The Author(s)

PDF Article
This paper was not presented at the conference
More Like This
Laser-induced forward transfer of aluminium particles in different gaseous environment

M. H. Azhdast, H. J. Eichler, K.-D. Lang, V. Glaw, and M. Kossatz
JT5A.21 Compact EUV & X-ray Light Sources (EUVXRAY) 2018

Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from Aluminum and Copper on Silicon wafer substrate

M. H. Azhdast, M. Kossatz, H. J. Eichler, K.-D. Lang, and V. Glaw
ATu4C.2 CLEO: Applications and Technology (CLEO:A&T) 2017

Transfer of Particles by Laser-Induced Forward Transfer Technique

Yoshiki Nakata, Tatsuo Okada, and Mitsuo Maeda
MB3_2 Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2001

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use