Thermal damage free materials processing by using ultrashort pulse laser

Sung Kwon Shin; Jun Gyu Hur; Jong Kab Park; Do Hun Kim

doi:10.1364/CLEO_AT.2019.ATu3I.6

Conference on Lasers and Electro-Optics
OSA Technical Digest (Optica Publishing Group, 2019),
paper ATu3I.6
•https://doi.org/10.1364/CLEO_AT.2019.ATu3I.6

Thermal damage free materials processing by using ultrashort pulse laser

Sung Kwon Shin, Jun Gyu Hur, Jong Kab Park, and Do Hun Kim

CLEO: Applications and Technology 2019

San Jose, California United States
5–10 May 2019
ISBN: 978-1-943580-57-6

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Ultrafast Laser Processing (ATu3I)

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S. K. Shin, J. G. Hur, J. K. Park, and D. H. Kim, "Thermal damage free materials processing by using ultrashort pulse laser," in Conference on Lasers and Electro-Optics, OSA Technical Digest (Optica Publishing Group, 2019), paper ATu3I.6.

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Abstract

We report thermal damage free processing in Invar, polyimide, and soda-lime glass by using an ultrashort pulse laser. Experimental results and a toy model for thermal accumulation will be discussed.

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