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Conferences > FiO > 2005 > FTuP > FTuP1

Optical interconnects for intrachip global communications

Michael J. McFadden, Muzammil Iqbal, and Michael W. Haney

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Abstract

The challenges faced by on-chip metal wiring are quantified and opportunities for optical interconnects identified. Scalable solutions are proposed and demonstrated to meet future on-chip interconnect requirements and prevent the saturation of Moore’s Law.

© 2005 Optical Society of America

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