Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems

C. Koos; C. Koos; W. Freude; W. Freude; J. Leuthold; J. Leuthold; L. Alloatti; R. Palmer; D. Korn; J. Pfeifle; P. C. Schindler; M. Lauermann; N. Lindenmann; N. Lindenmann; S. Koeber; S. Koeber; T. Hoose; T. Hoose; M. R. Billah; M. R. Billah; H. Yu; W. Bogaerts; R. Baets; M. Fournier; J.-M. Fedeli; R. Dinu; J. Bolten; T. Wahlbrink; M. Waldow

doi:10.1364/FIO.2013.FTu1E.3

Frontiers in Optics 2013
OSA Technical Digest (online) (Optica Publishing Group, 2013),
paper FTu1E.3
•https://doi.org/10.1364/FIO.2013.FTu1E.3

Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems

C. Koos, W. Freude, J. Leuthold, L. Alloatti, R. Palmer, D. Korn, J. Pfeifle, P. C. Schindler, M. Lauermann, N. Lindenmann, S. Koeber, T. Hoose, M. R. Billah, H. Yu, W. Bogaerts, R. Baets, M. Fournier, J.-M. Fedeli, R. Dinu, J. Bolten, T. Wahlbrink, and M. Waldow

Frontiers in Optics 2013

Orlando, Florida United States
6–10 October 2013
ISBN: 978-1-55752-987-9

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Hybrid Integrated Photonics (FTu1E)

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C. Koos, W. Freude, J. Leuthold, L. Alloatti, R. Palmer, D. Korn, J. Pfeifle, P. C. Schindler, M. Lauermann, N. Lindenmann, S. Koeber, T. Hoose, M. R. Billah, H. Yu, W. Bogaerts, R. Baets, M. Fournier, J. -. Fedeli, R. Dinu, J. Bolten, T. Wahlbrink, and M. Waldow, "Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems," in Frontiers in Optics 2013, I. Kang, D. Reitze, N. Alic, and D. Hagan, eds., OSA Technical Digest (online) (Optica Publishing Group, 2013), paper FTu1E.3.

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Abstract

The functionality of silicon photonics can be extended by combination with organic materials and by multi-chip integration. We give an overview of the underlying concepts of silicon-organic hybrid (SOH) integration and photonic wire bonding.

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