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  • Imaging and Applied Optics 2018 (3D, AO, AIO, COSI, DH, IS, LACSEA, LS&C, MATH, pcAOP)
  • OSA Technical Digest (Optica Publishing Group, 2018),
  • paper JTu4A.30
  • https://doi.org/10.1364/3D.2018.JTu4A.30

3D IC/Stacked Device Fault Isolation using Lock-in Infrared Microscopy

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Abstract

A lock-in infrared microscopy for 3D IC/Stacked device fault detection is developed. The fault is localized in 3-dimension by the thermal difference of an amplitude image and depth estimation from phase image considering the thermal diffusivity.

© 2018 The Author(s)

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