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MACOM’s L-PIC™ (Laser Integrated PIC) Platform Using Self-Aligned Etch Facet Technology (SAEFT™) For Data Center Networks

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Abstract

MACOM has addressed the DC Interconnect module model by developing a platform providing a solution minimizing module yield problems merged with a cost effective manufacturing approach to provide silicon photonic circuits with integrated lasers.

© 2017 Optical Society of America

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