Abstract
Optical fibers are of potential use in data links for computers and switching systems.1 As in the case of integrated circuits, the cost and size of the electro-optical interfaces can be decreased by using a batch fabrication process, by having several optical devices sharing an identical package, and by placing several optical devices and integrated circuits together in a single package. This integration of fiber optics and integrated circuits technologies poses a new challenge for IC packaging because a package must include electronic components, electro-optical interfaces, electrical connections, and optical connections.
© 1979 Optical Society of America
PDF ArticleMore Like This
T. N. C. Venkatesan and K. Ogawa
ThF3 Optical Fiber Communication Conference (OFC) 1979
F. Kiamilev, P. Chandramani, P. Gui, J. Ekman, B. Vanvoorst, F. Rose, K. Driscoll, J. A. Cox, M. Christensen, P. Milojkovic, and M. Haney
CWJ3 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 2000
R. A. Novotny, M. J. Wojcik, M. G. Beckman, S. J. Hinterlong, A. L. Lentine, E. Kerbis, J. L. Brubaker, G. K. McNees, L. M. F. Chirovsky, M. W. Focht, G. Guth, K. G. Glogovsky, R. Leibenguth, M. T. Asom, J. M. Freund, Y. M. Wong, N. Basavanhally, R. J. Crisci, K. Mersereau, C. Nijander, H. N. Nguyen, R. Borutta, L. A. D'Asaro, D. Vakhshoori, J. D. Wynn, and G. Hasnain
WI4 Optical Fiber Communication Conference (OFC) 1993