Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > OFC > 2019 > M4D > M4D.6

Multi-wavelength Optical Transceivers Integrated on Node (MOTION)

Daniel Kuchta, Jonathan Proesel, Fuad Doany, Wooram Lee, Timothy Dickson, Herschel Ainspan, Mounir Meghelli, Petar Pepeljugoski, Xiaoxiong Gu, Michael Beakes, Mark Schultz, Marc Taubenblatt, Paul Fortier, Catherine Dufort, Eric Turcotte, Marc-Olivier Pion, Charles Bureau, Frank Flens, Greta Light, Blake Trekell, and Kevin Koski

Not Accessible

Your library or personal account may give you access

Abstract

We report on efforts to develop a high speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.

© 2019 The Author(s)

PDF Article
More Like This
Motion: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers

D. Kuchta, M. Meghelli, P. Pepeljugoski, L. Schares, M. Schultz, P. Maniotis, P. Fortier, E. Tucotte, C. Bureau, M. Pion, Y. Cossette, G. Jutras, B. Sow, B. Parikh, S. Ostrander, S. Li, D. Becker, F. Gholami, H. Bagheri, F. Flens, G. Light, and B. Wang
NeTu1D.2 Photonic Networks and Devices (Networks) 2022

Developments of VCSEL-based transceivers for Co-Packaging

Daniel M. Kuchta
M4E.6 Optical Fiber Communication Conference (OFC) 2023

Integrated Terahertz Transceivers for Multi-node Link Discovery and Localization

Hooman Saeidi, Suresh Venkatesh, Xuyang Lu, and Kaushik Sengupta
STh2F.6 CLEO: Science and Innovations (CLEO:S&I) 2021

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use