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A 25-Gbps×4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked Transmitter Module with 1.3-μm LD-Array-on- Si for On-Board Optics

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Abstract

A 4-channel wire-bond-free 3D-stacked transmitter module consisting of a 65-nm CMOS cascode shunt LD driver, 1.3-μm LD-array-on-Si, and LTCC interposer achieves simultaneous 4-channel 25-Gbps error-free transmission over 1.2-km-long SSMF, with power consumption of 2.67 mW/Gbps.

© 2019 The Author(s)

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