Abstract

An optical method for determining the position of microcircuit chips for wirebonding or electrical testing stations was evaluated. Optically smearing the chip image in one direction with a cylindrical lens produces a convenient means for determining both chip angular orientation and position. Digitized images from a linear photodiode array camera were analyzed. The results show that a class of microcircuit chips with medium scale integration can be aligned in angle and position to a higher accuracy than required for wirebonding and electrical testing stations.

© 1979 Optical Society of America

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