Abstract

An architecture of a passively assembled optical platform is suggested for a chip-to-chip optical interconnection system. The platform is constructed using all-fiber media for the optical paths: a fiber-embedded optical printed-circuit board (OPCB) and 90$^{\circ}$-bent fiber connector. The passive assembling was achieved by employing the guide pins/holes of commercialized ferrules in the optical link between the OPCB, 90$^{\circ}$-bent fiber connector, and the transmitter/receiver (Tx/Rx) module. From this interconnection scheme, a low total optical loss of ${- }{\hbox {5.3 dB}}$ was obtained. From an assembled platform with 10 Gb/s/ch $\times$ 4 ch Tx/Rx modules, a 7-Gb/s/ch data transmission was demonstrated with a bit error rate below $10 ^{-12}$, involving the optical and electrical crosstalk arisen in the whole channel operation.

© 2008 IEEE

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