Abstract

We report a novel lateral packaging approach using laser welding technique with angle polished fiber coupling to grating coupler embedded silicon photonic circuit. Measurements show the relax alignment tolerance for fiber packaging process. The packaging excess loss of 1.2 dB is achieved. The use of angle polished fiber for lateral fiber coupling enables an alternative way for cost-effective deployment of silicon photonics packaging in telecommunication systems.

© 2014 Optical Society of America

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References

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    [Crossref]
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    [Crossref]
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2014 (1)

2013 (2)

B. Snyder and P. O’Brien, “Packaging process for grating-coupled silicon photonic waveguides using angle-polished fibers,” IEEE Trans. Compon. Packag. Manuf. Tech. 3(6), 954–959 (2013).
[Crossref]

C. Li, H. Zhang, M. Yu, and G. Q. Lo, “CMOS-compatible high efficiency double-etched apodized waveguide grating coupler,” Opt. Express 21(7), 7868–7874 (2013).
[Crossref] [PubMed]

2011 (5)

2010 (2)

2009 (1)

2007 (1)

2005 (3)

2004 (1)

2002 (1)

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3μm square Si wire waveguides to singlemode fibres,” Electron. Lett. 38(25), 1669–1670 (2002).
[Crossref]

Absil, P.

Alonso-Ramos, C.

Antelius, M.

Ayre, M.

Baets, R.

Battista Preve, G.

L. Zimmermann, G. Battista Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics–a review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[Crossref]

Beckx, S.

Berroth, M.

Bienstman, P.

Bogaerts, W.

Burghartz, J.

Butschke, J.

Cheben, P.

Chen, X.

X. Chen, C. Li, C. K. Y. Fung, S. M. G. Lo, and H. K. Tsang, “Apodized waveguide grating couplers for efficient coupling to optical fibers,” IEEE Photon. Technol. Lett. 22(15), 1156–1158 (2010).
[Crossref]

De Dobbelaere, P.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. De Dobbelaere, “A Grating-Coupler-Enabled CMOS Photonics Platform,” IEEE Selected Topics in Quantum Electron. 17(3), 597–608 (2011).
[Crossref]

de Oliva-Rubio, J.

Dumon, P.

Eichele, C.

Fung, C. K. Y.

X. Chen, C. Li, C. K. Y. Fung, S. M. G. Lo, and H. K. Tsang, “Apodized waveguide grating couplers for efficient coupling to optical fibers,” IEEE Photon. Technol. Lett. 22(15), 1156–1158 (2010).
[Crossref]

Gloeckner, S.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. De Dobbelaere, “A Grating-Coupler-Enabled CMOS Photonics Platform,” IEEE Selected Topics in Quantum Electron. 17(3), 597–608 (2011).
[Crossref]

Gylfason, K. B.

Halir, R.

Janz, S.

Jiang, J. H.

B. Wang, J. H. Jiang, and G. P. Nordin, “Embedded, slanted grating for vertical coupling between fibers and silicon-on-insulator planar waveguides,” IEEE Photon. Technol. Lett. 17(9), 1884–1886 (2005).
[Crossref]

Kim, N.

Krauss, T. F.

Kunze, A.

Lamontagne, B.

Landles, K.

L. Zimmermann, G. Battista Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics–a review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[Crossref]

Lepage, G.

Letzkus, F.

Li, C.

Lin, Y.

Lo, G. Q.

Lo, S. M. G.

X. Chen, C. Li, C. K. Y. Fung, S. M. G. Lo, and H. K. Tsang, “Apodized waveguide grating couplers for efficient coupling to optical fibers,” IEEE Photon. Technol. Lett. 22(15), 1156–1158 (2010).
[Crossref]

Luyssaert, B.

Masini, G.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. De Dobbelaere, “A Grating-Coupler-Enabled CMOS Photonics Platform,” IEEE Selected Topics in Quantum Electron. 17(3), 597–608 (2011).
[Crossref]

Mekis, A.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. De Dobbelaere, “A Grating-Coupler-Enabled CMOS Photonics Platform,” IEEE Selected Topics in Quantum Electron. 17(3), 597–608 (2011).
[Crossref]

Molina-Fernández, I.

Molina-Fernández, Í.

Morita, H.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3μm square Si wire waveguides to singlemode fibres,” Electron. Lett. 38(25), 1669–1670 (2002).
[Crossref]

Narasimha, A.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. De Dobbelaere, “A Grating-Coupler-Enabled CMOS Photonics Platform,” IEEE Selected Topics in Quantum Electron. 17(3), 597–608 (2011).
[Crossref]

Nordin, G. P.

B. Wang, J. H. Jiang, and G. P. Nordin, “Embedded, slanted grating for vertical coupling between fibers and silicon-on-insulator planar waveguides,” IEEE Photon. Technol. Lett. 17(9), 1884–1886 (2005).
[Crossref]

O’Brien, P.

B. Snyder and P. O’Brien, “Packaging process for grating-coupled silicon photonic waveguides using angle-polished fibers,” IEEE Trans. Compon. Packag. Manuf. Tech. 3(6), 954–959 (2013).
[Crossref]

Ortega-Moñux, A.

Pinguet, T.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. De Dobbelaere, “A Grating-Coupler-Enabled CMOS Photonics Platform,” IEEE Selected Topics in Quantum Electron. 17(3), 597–608 (2011).
[Crossref]

Roelkens, G.

Rosin, T.

L. Zimmermann, G. Battista Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics–a review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[Crossref]

Sahni, S.

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. De Dobbelaere, “A Grating-Coupler-Enabled CMOS Photonics Platform,” IEEE Selected Topics in Quantum Electron. 17(3), 597–608 (2011).
[Crossref]

Schrauwen, J.

Selvaraja, S.

Shi, F. G.

Shoji, T.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3μm square Si wire waveguides to singlemode fibres,” Electron. Lett. 38(25), 1669–1670 (2002).
[Crossref]

Snyder, B.

B. Snyder and P. O’Brien, “Packaging process for grating-coupled silicon photonic waveguides using angle-polished fibers,” IEEE Trans. Compon. Packag. Manuf. Tech. 3(6), 954–959 (2013).
[Crossref]

Sohlström, H.

Song, J. H.

Taillaert, D.

Tekin, T.

L. Zimmermann, G. Battista Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics–a review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[Crossref]

Tsang, H. K.

X. Chen, C. Li, C. K. Y. Fung, S. M. G. Lo, and H. K. Tsang, “Apodized waveguide grating couplers for efficient coupling to optical fibers,” IEEE Photon. Technol. Lett. 22(15), 1156–1158 (2010).
[Crossref]

Tsuchizawa, T.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3μm square Si wire waveguides to singlemode fibres,” Electron. Lett. 38(25), 1669–1670 (2002).
[Crossref]

Van Campenhout, J.

Van Laere, F.

Van Thourhout, D.

Verheyen, P.

Vermeulen, D.

Vogel, W.

Wang, B.

B. Wang, J. H. Jiang, and G. P. Nordin, “Embedded, slanted grating for vertical coupling between fibers and silicon-on-insulator planar waveguides,” IEEE Photon. Technol. Lett. 17(9), 1884–1886 (2005).
[Crossref]

Wangüemert-Pérez, J. G.

Watanabe, T.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3μm square Si wire waveguides to singlemode fibres,” Electron. Lett. 38(25), 1669–1670 (2002).
[Crossref]

Wiaux, V.

Xu, D.-X.

Yamada, K.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3μm square Si wire waveguides to singlemode fibres,” Electron. Lett. 38(25), 1669–1670 (2002).
[Crossref]

Yu, M.

Zaoui, W. S.

Zavargo-Peche, L.

Zhang, H.

Zhang, J.

Zimmermann, L.

L. Zimmermann, G. Battista Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics–a review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[Crossref]

Electron. Lett. (1)

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada, and H. Morita, “Low loss mode size converter from 0.3μm square Si wire waveguides to singlemode fibres,” Electron. Lett. 38(25), 1669–1670 (2002).
[Crossref]

IEEE J. Sel. Top. Quantum Electron. (1)

L. Zimmermann, G. Battista Preve, T. Tekin, T. Rosin, and K. Landles, “Packaging and assembly for integrated photonics–a review of the ePIXpack photonics packaging platform,” IEEE J. Sel. Top. Quantum Electron. 17(3), 645–651 (2011).
[Crossref]

IEEE Photon. Technol. Lett. (2)

B. Wang, J. H. Jiang, and G. P. Nordin, “Embedded, slanted grating for vertical coupling between fibers and silicon-on-insulator planar waveguides,” IEEE Photon. Technol. Lett. 17(9), 1884–1886 (2005).
[Crossref]

X. Chen, C. Li, C. K. Y. Fung, S. M. G. Lo, and H. K. Tsang, “Apodized waveguide grating couplers for efficient coupling to optical fibers,” IEEE Photon. Technol. Lett. 22(15), 1156–1158 (2010).
[Crossref]

IEEE Selected Topics in Quantum Electron. (1)

A. Mekis, S. Gloeckner, G. Masini, A. Narasimha, T. Pinguet, S. Sahni, and P. De Dobbelaere, “A Grating-Coupler-Enabled CMOS Photonics Platform,” IEEE Selected Topics in Quantum Electron. 17(3), 597–608 (2011).
[Crossref]

IEEE Trans. Compon. Packag. Manuf. Tech. (1)

B. Snyder and P. O’Brien, “Packaging process for grating-coupled silicon photonic waveguides using angle-polished fibers,” IEEE Trans. Compon. Packag. Manuf. Tech. 3(6), 954–959 (2013).
[Crossref]

J. Lightwave Technol. (3)

Opt. Express (5)

Opt. Lett. (3)

Other (1)

B. Snyder and P. O’Brien, “Planar fiber packaging method for silicon photonic integrated circuits,” in proceedings of OFC/NFOEC 2012.

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Figures (5)

Fig. 1
Fig. 1 (a) Schematic of angle polished fiber coupling to a double-etched apodized waveguide grating coupler. (b) Top-view scanning electron micrograph (SEM) of the fabricated grating coupler. (c), (d) Zoom-in view SEM images of the device.
Fig. 2
Fig. 2 (a) Side-view and (b) top-view optical micrograph of angle polished fiber coupling to grating coupler. (c) Measure insertion loss as a function of wavelength for planar and vertical fiber coupling.
Fig. 3
Fig. 3 Measured alignment tolerance (a) along and across the grating coupler; (b) with distance variation between fiber cladding and grating coupler; (c) with angular misalignment (swing and tilt); (d) with rotation along fiber axis.
Fig. 4
Fig. 4 (a) Schematic of the packaging structure. Inset (i) shows laser welding station (Suruga Seiki YS-4000). (b) Packaged sub-assembly using YAG laser welding technique. (c) Full packaging circuit of the silicon optical tunable filter with fiber assembly.
Fig. 5
Fig. 5 Measured spectra comparison between angle polished fibers coupling to chip and packaged module with fiber assembly.

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