Abstract

Displays using direct light emission from microscale inorganic light-emitting diodes (μILEDs) have the potential to be very bright and also very power efficient. High-throughput technologies that accurately and cost-effectively assemble microscale devices on display substrates with high yield are key enablers for μILED displays. Elastomer stamp transfer printing is such a candidate assembly technology. A variety of μILED displays have been designed and fabricated by transfer printing, including passive-matrix and active-matrix displays on glass and plastic substrates.

© 2017 Chinese Laser Press

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References

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    [Crossref]
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    [Crossref]
  3. X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
    [Crossref]
  4. H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).
  5. J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers,” Nat. Photonics 6, 612–616 (2012).
    [Crossref]
  6. R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
    [Crossref]
  7. D. H. Kim, N. Lu, R. Ghaffari, and J. A. Rogers, “Inorganic semiconductor nanomaterials for flexible and stretchable bio-integrated electronics,” NPG Asia Mater. 4, e15 (2012).
    [Crossref]
  8. S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
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    [Crossref]
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    [Crossref]
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    [Crossref]
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    [Crossref]
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  14. C. A. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display backplanes,” in Proceedings of International Display Workshop (2010), pp. 1203–1206.
  15. J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
    [Crossref]
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    [Crossref]
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    [Crossref]
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    [Crossref]
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2016 (4)

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

J. F. Tremblay, “The rise of OLED displays,” Chem. Eng. News 94, 29–34 (2016).

2015 (1)

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

2014 (1)

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

2012 (5)

D. H. Kim, N. Lu, R. Ghaffari, and J. A. Rogers, “Inorganic semiconductor nanomaterials for flexible and stretchable bio-integrated electronics,” NPG Asia Mater. 4, e15 (2012).
[Crossref]

J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers,” Nat. Photonics 6, 612–616 (2012).
[Crossref]

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

A. Carlson, S. Wang, P. Elvikis, P. M. Ferreira, Y. Huang, and J. A. Rogers, “Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing,” Adv. Funct. Mater. 22, 4476–4484 (2012).
[Crossref]

2011 (3)

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

C. A. Bower, E. Menard, S. Bonafede, J. W. Hamer, and R. S. Cok, “Transfer-printed microscale integrated circuits for high performance display backplanes,” IEEE Trans. Compon. Packag. Manuf. 1, 1916–1922 (2011).
[Crossref]

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

2009 (1)

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

2006 (1)

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

2004 (1)

E. Menard, K. J. Lee, D.-Y. Khang, R. G. Nuzzo, and J. A. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Adesida, I.

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Banks, A. R.

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

Bonafede, S.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

C. A. Bower, E. Menard, S. Bonafede, J. W. Hamer, and R. S. Cok, “Transfer-printed microscale integrated circuits for high performance display backplanes,” IEEE Trans. Compon. Packag. Manuf. 1, 1916–1922 (2011).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

M. Lueck, A. Huffman, P. Hines, J. Lannon, S. Bonafede, A. J. Trindade, and C. A. Bower, “Fan-out packaging of microdevices assembled using micro-transfer-printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 37–42.

Bower, C. A.

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers,” Nat. Photonics 6, 612–616 (2012).
[Crossref]

C. A. Bower, E. Menard, S. Bonafede, J. W. Hamer, and R. S. Cok, “Transfer-printed microscale integrated circuits for high performance display backplanes,” IEEE Trans. Compon. Packag. Manuf. 1, 1916–1922 (2011).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

C. A. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display backplanes,” in Proceedings of International Display Workshop (2010), pp. 1203–1206.

M. Lueck, A. Huffman, P. Hines, J. Lannon, S. Bonafede, A. J. Trindade, and C. A. Bower, “Fan-out packaging of microdevices assembled using micro-transfer-printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 37–42.

Brueckner, E.

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

Burroughs, S.

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

Carlson, A.

A. Carlson, S. Wang, P. Elvikis, P. M. Ferreira, Y. Huang, and J. A. Rogers, “Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing,” Adv. Funct. Mater. 22, 4476–4484 (2012).
[Crossref]

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

Cheng, H.

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

Choquette, K.

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Choquette, K. D.

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

Cok, R. S.

C. A. Bower, E. Menard, S. Bonafede, J. W. Hamer, and R. S. Cok, “Transfer-printed microscale integrated circuits for high performance display backplanes,” IEEE Trans. Compon. Packag. Manuf. 1, 1916–1922 (2011).
[Crossref]

Corbett, B.

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers,” Nat. Photonics 6, 612–616 (2012).
[Crossref]

Corcoran, C. J.

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

Cox, B.

C. A. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display backplanes,” in Proceedings of International Display Workshop (2010), pp. 1203–1206.

Elgan, S.

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

Elvikis, P.

A. Carlson, S. Wang, P. Elvikis, P. M. Ferreira, Y. Huang, and J. A. Rogers, “Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing,” Adv. Funct. Mater. 22, 4476–4484 (2012).
[Crossref]

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Fecioru, A.

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

Feng, X.

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Ferreira, P.

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Ferreira, P. M.

A. Carlson, S. Wang, P. Elvikis, P. M. Ferreira, Y. Huang, and J. A. Rogers, “Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing,” Adv. Funct. Mater. 22, 4476–4484 (2012).
[Crossref]

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

Fisher, B.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

Ghaffari, R.

D. H. Kim, N. Lu, R. Ghaffari, and J. A. Rogers, “Inorganic semiconductor nanomaterials for flexible and stretchable bio-integrated electronics,” NPG Asia Mater. 4, e15 (2012).
[Crossref]

Ghosal, K.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

Gocalinska, A.

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

Gomez, D.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

C. A. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display backplanes,” in Proceedings of International Display Workshop (2010), pp. 1203–1206.

Gubbins, M. A.

J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers,” Nat. Photonics 6, 612–616 (2012).
[Crossref]

Guven, I.

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

Hamer, J. W.

C. A. Bower, E. Menard, S. Bonafede, J. W. Hamer, and R. S. Cok, “Transfer-printed microscale integrated circuits for high performance display backplanes,” IEEE Trans. Compon. Packag. Manuf. 1, 1916–1922 (2011).
[Crossref]

Hines, P.

M. Lueck, A. Huffman, P. Hines, J. Lannon, S. Bonafede, A. J. Trindade, and C. A. Bower, “Fan-out packaging of microdevices assembled using micro-transfer-printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 37–42.

Huang, Y.

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

A. Carlson, S. Wang, P. Elvikis, P. M. Ferreira, Y. Huang, and J. A. Rogers, “Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing,” Adv. Funct. Mater. 22, 4476–4484 (2012).
[Crossref]

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Huang, Y. Y.

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Huffman, A.

M. Lueck, A. Huffman, P. Hines, J. Lannon, S. Bonafede, A. J. Trindade, and C. A. Bower, “Fan-out packaging of microdevices assembled using micro-transfer-printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 37–42.

Hwang, K.-C.

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Jeong, H.

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

Jung, Y. H.

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

Justice, J.

J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers,” Nat. Photonics 6, 612–616 (2012).
[Crossref]

Kang, D.

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

Khang, D.-Y.

E. Menard, K. J. Lee, D.-Y. Khang, R. G. Nuzzo, and J. A. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Kim, D.

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

Kim, D. H.

D. H. Kim, N. Lu, R. Ghaffari, and J. A. Rogers, “Inorganic semiconductor nanomaterials for flexible and stretchable bio-integrated electronics,” NPG Asia Mater. 4, e15 (2012).
[Crossref]

Kim, D.-H.

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Kim, H.

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

Kim, H. S.

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

Kim, R. H.

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

Kim, R.-H.

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Kim, S.

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

Kim, T. I.

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

Kim-Lee, H.-J.

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

Kneeburg, D.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

C. A. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display backplanes,” in Proceedings of International Display Workshop (2010), pp. 1203–1206.

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

Kovalsky, A.

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

Kumar, V.

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Lannon, J.

M. Lueck, A. Huffman, P. Hines, J. Lannon, S. Bonafede, A. J. Trindade, and C. A. Bower, “Fan-out packaging of microdevices assembled using micro-transfer-printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 37–42.

Lee, J.

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

Lee, K. J.

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

E. Menard, K. J. Lee, D.-Y. Khang, R. G. Nuzzo, and J. A. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Lee, S. M.

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

Li, X.

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Li, Y.

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

Liu, Z.

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Loi, R.

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

Lu, C.

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

Lu, N.

D. H. Kim, N. Lu, R. Ghaffari, and J. A. Rogers, “Inorganic semiconductor nanomaterials for flexible and stretchable bio-integrated electronics,” NPG Asia Mater. 4, e15 (2012).
[Crossref]

Lucht, K.

C. A. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display backplanes,” in Proceedings of International Display Workshop (2010), pp. 1203–1206.

Lueck, M.

M. Lueck, A. Huffman, P. Hines, J. Lannon, S. Bonafede, A. J. Trindade, and C. A. Bower, “Fan-out packaging of microdevices assembled using micro-transfer-printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 37–42.

Meitl, M.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers,” Nat. Photonics 6, 612–616 (2012).
[Crossref]

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Meitl, M. A.

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

Menard, E.

C. A. Bower, E. Menard, S. Bonafede, J. W. Hamer, and R. S. Cok, “Transfer-printed microscale integrated circuits for high performance display backplanes,” IEEE Trans. Compon. Packag. Manuf. 1, 1916–1922 (2011).
[Crossref]

E. Menard, K. J. Lee, D.-Y. Khang, R. G. Nuzzo, and J. A. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Mooney, M. B.

J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers,” Nat. Photonics 6, 612–616 (2012).
[Crossref]

Moore, T.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

Nuzzo, R. G.

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

E. Menard, K. J. Lee, D.-Y. Khang, R. G. Nuzzo, and J. A. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

O’Callaghan, J.

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

Pao, H. A.

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

Park, S.-I.

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Pelucchi, E.

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

Prevatte, C.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

Radauscher, E.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

Raymond, B.

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

Robert, C.

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

Rogers, J. A.

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

D. H. Kim, N. Lu, R. Ghaffari, and J. A. Rogers, “Inorganic semiconductor nanomaterials for flexible and stretchable bio-integrated electronics,” NPG Asia Mater. 4, e15 (2012).
[Crossref]

A. Carlson, S. Wang, P. Elvikis, P. M. Ferreira, Y. Huang, and J. A. Rogers, “Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing,” Adv. Funct. Mater. 22, 4476–4484 (2012).
[Crossref]

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

E. Menard, K. J. Lee, D.-Y. Khang, R. G. Nuzzo, and J. A. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Roycroft, B.

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

Shen, L.

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

Sheng, X.

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

Song, I. S.

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

Song, J.

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

Song, Y. M.

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

Sulking, J.

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

Tremblay, J. F.

J. F. Tremblay, “The rise of OLED displays,” Chem. Eng. News 94, 29–34 (2016).

Trindade, A. J.

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

M. Lueck, A. Huffman, P. Hines, J. Lannon, S. Bonafede, A. J. Trindade, and C. A. Bower, “Fan-out packaging of microdevices assembled using micro-transfer-printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 37–42.

Turner, K. T.

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

Wang, S.

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

A. Carlson, S. Wang, P. Elvikis, P. M. Ferreira, Y. Huang, and J. A. Rogers, “Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing,” Adv. Funct. Mater. 22, 4476–4484 (2012).
[Crossref]

Wierer, J. J.

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

Wilson, J.

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

Wu, J.

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Xiong, Y.

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Yoon, J.

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Yu, C.-J.

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

Yu, Q.

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

Yuen, H.

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

Zhu, Z.-T.

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

Adv. Funct. Mater. (1)

A. Carlson, S. Wang, P. Elvikis, P. M. Ferreira, Y. Huang, and J. A. Rogers, “Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing,” Adv. Funct. Mater. 22, 4476–4484 (2012).
[Crossref]

Adv. Opt. Mater. (1)

J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. A. Rogers, “Heterogeneously integrated optoelectronic devices enabled by micro‐transfer printing,” Adv. Opt. Mater. 3, 1313–1335 (2015).
[Crossref]

Appl. Phys. Lett. (3)

C. Prevatte, I. Guven, K. Ghosal, D. Gomez, T. Moore, S. Bonafede, B. Raymond, A. J. Trindade, A. Fecioru, D. Kneeburg, M. A. Meitl, and C. A. Bower, “Pressure activated interconnection of micro transfer printed components,” Appl. Phys. Lett. 108, 203503 (2016).
[Crossref]

A. Carlson, H.-J. Kim-Lee, J. Wu, P. Elvikis, H. Cheng, A. Kovalsky, S. Elgan, Q. Yu, P. M. Ferreira, Y. Huang, K. T. Turner, and J. A. Rogers, “Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly,” Appl. Phys. Lett. 98, 264104 (2011).
[Crossref]

E. Menard, K. J. Lee, D.-Y. Khang, R. G. Nuzzo, and J. A. Rogers, “A printable form of silicon for high performance thin film transistors on plastic substrates,” Appl. Phys. Lett. 84, 5398–5400 (2004).
[Crossref]

Chem. Eng. News (1)

J. F. Tremblay, “The rise of OLED displays,” Chem. Eng. News 94, 29–34 (2016).

IEEE Photon. J. (1)

R. Loi, J. O’Callaghan, B. Roycroft, C. Robert, A. Fecioru, A. J. Trindade, A. Gocalinska, E. Pelucchi, C. A. Bower, and B. Corbett, “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J. 8, 1–10 (2016).
[Crossref]

IEEE Trans. Compon. Packag. Manuf. (1)

C. A. Bower, E. Menard, S. Bonafede, J. W. Hamer, and R. S. Cok, “Transfer-printed microscale integrated circuits for high performance display backplanes,” IEEE Trans. Compon. Packag. Manuf. 1, 1916–1922 (2011).
[Crossref]

Nat. Mater. (2)

M. A. Meitl, Z.-T. Zhu, V. Kumar, K. J. Lee, X. Feng, Y. Y. Huang, I. Adesida, R. G. Nuzzo, and J. A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nat. Mater. 5, 33–38 (2006).
[Crossref]

X. Sheng, C. A. Bower, S. Bonafede, J. Wilson, B. Fisher, M. Meitl, H. Yuen, S. Wang, L. Shen, A. R. Banks, C. J. Corcoran, R. G. Nuzzo, S. Burroughs, and J. A. Rogers, “Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules,” Nat. Mater. 13, 593–598 (2014).
[Crossref]

Nat. Photonics (1)

J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer scale integration of III V lasers on silicon using transfer printing of epitaxial layers,” Nat. Photonics 6, 612–616 (2012).
[Crossref]

NPG Asia Mater. (1)

D. H. Kim, N. Lu, R. Ghaffari, and J. A. Rogers, “Inorganic semiconductor nanomaterials for flexible and stretchable bio-integrated electronics,” NPG Asia Mater. 4, e15 (2012).
[Crossref]

Proc. Natl. Acad. Sci. USA (1)

H. Kim, E. Brueckner, J. Song, Y. Li, S. Kim, C. Lu, J. Sulking, K. Choquette, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting,” Proc. Natl. Acad. Sci. USA 108, 10072–10077 (2011).

Science (1)

S.-I. Park, Y. Xiong, R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J. A. Rogers, “Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays,” Science 325, 977–981 (2009).
[Crossref]

SID Symp. Dig. Tech. Pap. (1)

M. Meitl, E. Radauscher, S. Bonafede, D. Gomez, T. Moore, C. Prevatte, B. Raymond, B. Fisher, K. Ghosal, A. Fecioru, A. J. Trindade, D. Kneeburg, and C. A. Bower, “55‐1: Invited paper: passive matrix displays with transfer‐printed microscale inorganic LEDs,” SID Symp. Dig. Tech. Pap. 47, 743–746 (2016).
[Crossref]

Small (2)

R. H. Kim, S. Kim, Y. M. Song, H. Jeong, T. I. Kim, J. Lee, X. Li, K. D. Choquette, and J. A. Rogers, “Flexible vertical light emitting diodes,” Small 8, 3123–3128 (2012).
[Crossref]

T. I. Kim, Y. H. Jung, J. Song, D. Kim, Y. Li, H. S. Kim, I. S. Song, J. J. Wierer, H. A. Pao, Y. Huang, and J. A. Rogers, “High‐efficiency, microscale GaN light‐emitting diodes and their thermal properties on unusual substrates,” Small 8, 1643–1649 (2012).
[Crossref]

Other (6)

J. A. Castellano, ed., Handbook of Display Technology (Elsevier, 2012).

R. Street, ed., Technology and Applications of Amorphous Silicon (Springer Science & Business Media, 2013), Vol. 37.

D. Gomez, K. Ghosal, M. A. Meitl, S. Bonafede, C. Prevatte, T. Moore, B. Raymond, D. Kneeburg, A. Fecioru, A. J. Trindade, and C. A. Bower, “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 680–687.

C. A. Bower, D. Gomez, K. Lucht, B. Cox, and D. Kneeburg, “Transfer-printed integrated circuits for display backplanes,” in Proceedings of International Display Workshop (2010), pp. 1203–1206.

http://www.xfab.com/technology/soi/018-um-xt018/ .

M. Lueck, A. Huffman, P. Hines, J. Lannon, S. Bonafede, A. J. Trindade, and C. A. Bower, “Fan-out packaging of microdevices assembled using micro-transfer-printing,” in Proceedings of the 66th IEEE Electronic Components and Technology Conference (ECTC) (2016), pp. 37–42.

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Figures (8)

Fig. 1.
Fig. 1. Illustration of a conceptual μILED display.
Fig. 2.
Fig. 2. (a) Transfer stamp retrieves an array of micro-devices from a native wafer with densely packed micro-devices and (b) transfers the dispersed micro-devices onto the receiving substrate. (c) A transfer stamp is illustrated in cross section and (d) in a photograph of a transfer stamp with a 100  mm×50  mm active area. The inset shows an electron micrograph of the surface relief on the elastomer stamp.
Fig. 3.
Fig. 3. (a) Illustration of the process steps for making printable μILEDs. (b) Optical micrograph of a μILED wafer, and (c) electron micrograph of a released, ready-to-retrieve, μILED.
Fig. 4.
Fig. 4. (a) Illustration of passive-matrix μILED display fabrication. (b) Optical micrograph taken after printing and via formation, and (c) optical micrograph of the completed passive-matrix display.
Fig. 5.
Fig. 5. (a) Photograph of a blue 10  mm×10  mm, 254 PPI, passive-matrix display, and (b) higher magnification image showing the pixels during operation. (c) Photograph of a full-color 20  mm×20  mm, 127 PPI, passive-matrix display, and (d) close-up image of the pixels during operation.
Fig. 6.
Fig. 6. (a) Luminance of a 254 PPI passive-matrix display as a function of the duty cycle, or number of active rows. (b) Luminance measured versus viewing angle. (c) Photograph of a 127 PPI μILED with a 9 V battery in the background illustrating the transparency of the display. (d) Measured optical transmission versus wavelength for the 127 PPI display. (e),(f) Photographs of the plastic, flexible, passive-matrix μILED display.
Fig. 7.
Fig. 7. (a) Photograph of the 254 PPI full-color display that was used for the subpixel yield measurement, and (b)–(d) individual photographs with the respective subpixels (red, green, and blue) turned on separately.
Fig. 8.
Fig. 8. (a) Process sequence for making the active-matrix μILED display. (b) Optical micrograph of a single pixel after printing the μILEDs and μICs. (c) Electron micrograph of a fully processed active-matrix display. (d) Circuit diagram illustrating the display control architecture. (e) Photograph of the 127 PPI active-matrix display in operation. (f) Color gamut of the display.

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